The Prime X299-A II caters to users with serious pursuits: Those who prefer to put their high-core-count processors to more productive use. This high-end desktop board combines cutting-edge performance with our signature features, including an enhanced VRM tailored for running the CPU performance at stock speeds, intuitive cooling control, next-gen connectivity, and extensive customization.
Get the most out of all your cores
Intel®'s high-end desktop platform raises the stakes with updated Intel Core™ X-Series Processors that boast cores, cache, and bandwidth. The Prime X299-A II is ready for the additional processing power that plows through CPU-intensive tasks, and the extra bandwidth allows you to add more GPUs and NVMe SSDs to accelerate a wide range of work.
Robust Power Design
The LGA 2066 socket is compatible with Intel Core X-Series Processors with up to 18 cores, over 44 PCI Express® lanes, and 165-watt thermal design power (TDP). Those specs require serious power, so the Prime X299-A II is equipped with an enhanced power solution that includes 12 power stages that line up neatly along the top edge of the PCB.
Make Yout Memory Go Faster
The X299 platform delivers ample bandwidth on multiple fronts. Its quad-channel memory controller supports up to 256 GB of DDR4 memory across eight slots. With optimized trace layout, the Prime X299-A II can hit memory speeds up to DDR4 4266 MHz or beyond.
Multi-GPU support
Fully loaded takes on a new meaning when you have over 44 PCI Express lanes stemming from the CPU. Those lanes can be split in an x16/x16/x8 configuration spanning the board's trio of PCIe x16 slots, allowing you to load up on GPUs to accelerate an increasingly diverse array of work.
M.2
Achieve speed with onboard M.2
Professional applications require fast solid-state storage, which is why the Prime X299-A II is equipped with three M.2 slots that are compatible with the latest NVMe SSDs. All slots support longer 110 mm drives, and they can be configured into bootable RAID arrays connected directly to the CPU via Intel VROC technology.
USB 3.2 Gen 2 front-panel connector
Future-proof connectivity
Plenty of USB ports are provided to support high-end rigs loaded with peripherals, including a front-panel header with faster USB 3.2 Gen 2 connectivity for compatible cases.
Intel Ethernet
More throughput, less CPU usage and great gaming experiences
The latest Intel I219-V Ethernet has the advantage of reducing CPU overhead and offering exceptionally high TCP and UDP throughput for faster, smoother data transfer.
for more information : Prime-X299-A-II
CPU | Intel® Socket 2066 Core™
X-Series Processors * The Intel® Turbo Boost Max Technology 3.0 support depends on the CPU types * Refer to www.asus.com for CPU support list |
Chipset | Intel® X299 |
Memori | (Intel® Core™ i9 10000 X-Series
CPU) 8 x DIMM, Max. 256GB, DDR4 4266(O.C.)/4133(O.C.)/4000(O.C.)/3866(O.C.)/3800(O.C.)/3733(O.C.)/3600(O.C.)/3466(O.C.)/3400(O.C.)/3333(O.C.)/3300(O.C.)/3200(O.C.)/3000(O.C.)/2933/2800/2666/2400/2133 MHz Non-ECC, Un-buffered Memory (Intel® Core™ i9 9000/7000 and i7 9000 X-Series CPU) 8 x DIMM, Max. 256GB, DDR4 4266(O.C.)/4133(O.C.)/4000(O.C.)/3866(O.C.)/3800(O.C.)/3733(O.C.)/3600(O.C.)/3466(O.C.)/3400(O.C.)/3333(O.C.)/3300(O.C.)/3200(O.C.)/3000(O.C.)/2933(O.C.)/2800(O.C.)/2666/2400/2133 MHz Non-ECC, Un-buffered Memory Supports Intel® Extreme Memory Profile (XMP) * Refer to www.asus.com or user manual for the Memory QVL (Qualified Vendors Lists). * Hyper DIMM support is subject to the physical characteristics of individual CPUs. |
Grafis | |
Multi Gpu | Supports NVIDIA® Quad-GPU SLI®
Technology Supports NVIDIA® 3-Way SLI® Technology Supports NVIDIA® 2-Way SLI® Technology Supports AMD Quad-GPU CrossFireX™ Technology Supports AMD 3-Way CrossFireX™ Technology |
Slot Ekspansi | 48-Lane CPU- 3 x PCIe 3.0/2.0 x16 (x16, x16/x16, x16/x16/x8) 2 x PCIe 3.0/2.0 x1 *1 44-Lane CPU- 3 x PCIe 3.0/2.0 x16 (x16, x16/x16, x16/x16/x8) 2 x PCIe 3.0/2.0 x1 *1 28-Lane CPU- 2 x PCIe 3.0/2.0 x16 (x16, x16/x8) *2 2 x PCIe 3.0/2.0 x1 *1 1 x M.2 Socket 1 with E key, type 2230 for WIFI/BT devices support PCIE/USB mode* * The Wi-Fi E key shares bandwidth with PCIEX1_1. * The Wi-Fi/BT module is purchased separately |
Storage | Intel® X299 Chipset : 1 x M.2 x4 Socket 3, with M key, type 2242/2260/2280/22110 storage devices support (SATA & PCIE 3.0 x 4 mode)*3 1 x M.2 x4 Socket 3, with M key, type 2242/2260/2280/22110 storage devices support (PCIE 3.0 x 4 mode)*4 8 x SATA 6Gb/s port(s)*5 Support Raid 0, 1, 5, 10 Intel® Rapid Storage Technology supports (Intel® Core™ i9 10000 X-Series CPU) : 2 x M.2 x4 Socket 3, with M key, type 2242/2260/2280/22110 storage devices support (PCIE 3.0 x 4 mode) Support Raid 0, 1, 5, 10 Intel® Rapid Storage Technology Enterprise supports (Intel® Core™ i9 9000/7000 and i7 9000 X-Series CPU) : 1 x M.2 x4 Socket 3, with M key, type 2242/2260/2280/22110 storage devices support (PCIE 3.0 x 4 mode) Support Raid 0, 1, 5, 10 Intel® Rapid Storage Technology 15 support Intel® Optane™ Memory Ready * |
LAN | Intel® I219V, 1 x Gigabit
LAN ASUS Turbo LAN Utility ASUS LAN Guard |
Audio | Realtek® S1220A 8-Channel High
Definition Audio CODEC - Power pre-regulator reduces power input noise to ensure consistent performance - Impedance sense for front and rear headphone outputs - Internal audio Amplifier to enhance the highest quality sound for headphone and speakers - Supports : Jack-detection, Multi-streaming, Front Panel Jack-retasking Audio Feature : - DTS X®:Ultra - Optical S/PDIF out port(s) at back panel - Audio Shielding: Ensures precision analog/digital separation and greatly reduced multi-lateral interference - Dedicated audio PCB layers: Separate layers for left and right channels to guard the quality of the sensitive audio signals - Premium Japanese-made audio capacitors: Provide warm, natural and immersive sound with exceptional clarity and fidelity - Unique de-pop circuit: Reduces start-up popping noise to audio outputs |
Port USB | ASMedia® USB 3.2 Gen 2
controller : *1 1 x USB 3.2 Gen 2 front panel connector port(s) ASMedia® USB 3.2 Gen 2 controller : *1 2 x USB 3.2 Gen 2 (up to 10Gbps) port(s) (2 at back panel, , Type-A + USB Type-CTM) Intel® X299 Chipset : 8 x USB 3.2 Gen 1 port(s) (4 at back panel, , 4 at mid-board) Intel® X299 Chipset : 6 x USB 2.0 port(s) (2 at back panel, , 4 at mid-board) |
Port I/O Belakang | 1 x PS/2 keyboard/mouse combo
port(s) 1 x LAN (RJ45) port(s) 4 x USB 3.2 Gen 1 2 x USB 2.0 (one port can be switched to USB BIOS FlashBack™) 1 x Optical S/PDIF out 5 x Audio jack(s) 1 x USB BIOS FlashBack™ Button(s) 2 x USB 3.2 Gen 2 (up to 10Gbps) ports (Type-A + USB Type-CTM) |
I/O Internal | 1 x AAFP connector 2 x Aura RGB Strip Headers 1 x Addressable Gen 2 header(s) 1 x USB 3.2 Gen 1 front panel TypeC™ connector 2 x USB 3.2 Gen 1(up to 5Gbps) connector(s) support(s) additional 4 USB 3.2 Gen 1 port(s) 2 x USB 2.0 connector(s) support(s) additional 4 USB 2.0 port(s) 1 x M.2 Socket 3 with M key, type 2242/2260/2280/22110 storage devices support (SATA & PCIE 3.0 x 4 mode) 2 x M.2 Socket 3 with M key, type 2242/2260/2280/22110 storage devices support (PCIE 3.0 x 4 mode) 1 x COM port(s) connector(s) 8 x SATA 6Gb/s connector(s) 1 x M.2_FAN connector 1 x VROC_HW_Key 1 x CPU Fan connector(s) 1 x CPU OPT Fan connector(s) 2 x Chassis Fan connector(s) 1 x W_PUMP+ connector 1 x AIO_PUMP connector 1 x Thunderbolt header (5-pin) for ASUS ThunderboltEX series support 1 x 24-pin EATX Power connector(s) 2 x 8-pin EATX 12V Power connectors 1 x Front panel audio connector(s) (AAFP) 1 x System panel(s) (Q-Connector) (Chassis intrusion header is inbuilt) 1 x Thermal sensor connector(s) 1 x Power-on button(s) 1 x Clear CMOS jumper(s) 1 x Node Connector(s) 1 x CPU_OV jumper 1 x Q-Code |
Operating System Support | Windows® 10 64-bit |
Form Factor | ATX Form Factor 12 inch x 9.6 inch ( 30.5 cm x 24.4 cm ) |